3-D Printed Electric Package Heat Sink
Electrical Engineering
Team 29
Jagger King, Hunter McKinney, Mark Kleckner, Remi Langbehn, Madison Jamieson
Summary
This project develops cost-effective, 3-D printed heat sinks to provide thermal management in electronic devices. Through this work, the team is advancing the use of thermally conductive polymers and additive manufacturing for next-generation electronic cooling solutions.